Construction permits conductivity through, tape and adhesive.
Solderable for circuit repair on PC boards.
Electromagnetic and radio frequency shielding of microwave components, cables, antennas, and motors.
Tin improves solderability and corrosion resistance.
PRODUCT ID: 888-L
DESCRIPTION: PRESSURE SENSITIVE PRODUCTS
Products Engineered to your Specifications
Backing: 0.0014” (1 oz.) Copper Foil tinned on both sides.
Adhesive: Acrylic, Conductive
Interliner: Polyethylene Coated Paper liner
- Construction permits conductivity through, tape and adhesive.
- Solderable for circuit repair on PC boards.
- Electromagnetic and radio frequency shielding of microwave components, cables, antennas, and motors.
- Tin improves solderability and corrosion resistance.
|Thickness:||0.00345 inch +/- 10%||ASTM-D-374|
|Peel Strength:||30 oz./inch of width||ASTM-D-1000|
|Breaking Strength:||25 lbs./inch of width||ASTM-D-1000|
|Elongation at Break:||4%||ASTM-D-1000|
|Temperature Resistance:||155 degrees C.|
|Conductivity through Adhesive:||10 milliohms|
|Shelf Life:||1 year when stored under conditions of|
70 degrees F. (21 degrees C.) and 50% R.H.
Meets UL 510 Flame Test Specification
|P/N 6836||Date 09/22/98|
Physical and performance values and characteristics shown above are obtained through recommended test procedures. The above values do not represent a guarantee of product performance and are not intended for use in determining engineering specifications. Values represent nominal and average values; individual roll values may vary from average values indicated on the datasheet. User is responsible for determining suitability and fitness for use. User assumes all risk and liability whatsoever in connection therewith. Seller assumes no liability beyond the replacement value of material.