888-L

Construction permits conductivity through, tape and adhesive.
Solderable for circuit repair on PC boards.
Electromagnetic and radio frequency shielding of microwave components, cables, antennas, and motors.
Tin improves solderability and corrosion resistance.

SKU: pn6836 Category: Tags: ,

Description

PRODUCT ID: 888-L

DESCRIPTION: PRESSURE SENSITIVE PRODUCTS
Products Engineered to your Specifications

CONSTRUCTION:
Backing: 0.0014” (1 oz.) Copper Foil tinned on both sides.
Adhesive: Acrylic, Conductive
Interliner: Polyethylene Coated Paper liner

APPLICATION:

  • Construction permits conductivity through, tape and adhesive.
  • Solderable for circuit repair on PC boards.
  • Electromagnetic and radio frequency shielding of microwave components, cables, antennas, and motors.
  • Tin improves solderability and corrosion resistance.

 

PROPERTY VALUE TEST METHOD
Thickness: 0.00345 inch +/- 10% ASTM-D-374
Peel Strength: 30 oz./inch of width ASTM-D-1000
Breaking Strength: 25 lbs./inch of width ASTM-D-1000
Elongation at Break: 4% ASTM-D-1000
Temperature Resistance: 155 degrees C.
Conductivity through Adhesive: 10 milliohms
Color: Silver
Shelf Life: 1 year when stored under conditions of
70 degrees F. (21 degrees C.) and 50% R.H.

Meets UL 510 Flame Test Specification

P/N 6836 Date 09/22/98

 

Physical and performance values and characteristics shown above are obtained through recommended test procedures. The above values do not represent a guarantee of product performance and are not intended for use in determining engineering specifications. Values represent nominal and average values; individual roll values may vary from average values indicated on the datasheet. User is responsible for determining suitability and fitness for use. User assumes all risk and liability whatsoever in connection therewith. Seller assumes no liability beyond the replacement value of material.

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